Below-thresholdCloses in 19 days
CSAC2334 Thermal Interface Material (TiM) reliability tester
Semiconductor Catapult · published 10 Nov 2026
- Deadline
- 2 Dec 2026, 11:00 · questions by 23 Nov 2026, 11:00
- Estimated value
- £100,000 excluding VAT where stated
- Procedure
- Below threshold - open competition · below threshold
- Contract dates
- 5 Jan 2027 to 5 Jan 2028
- Where
- Wales
- Categories (CPV)
- 38000000 Laboratory, optical and precision equipments (excl. glasses)
- 71350000 Engineering-related scientific and technical services
- Award criteria
- Criterion 1 (price)20%
- Criterion 2 (quality)80%
Description
Semiconductor Catapult is interested in Ai characterisation tools and hardware and data centre applications. Thermal management is part of this scope and vision. We would like to expand our capabilities by installing a thermal interface materials reliability tester that is capable of adjusting the bond line measurements and adjusting the pressure applied for each test. The reliability of Thermal interface materials is important for data centre applications.
Notices for this procurement
- 10 Nov 2026 · Tender notice (update)106792-2026 (opens in a new tab)
- 10 Nov 2026 · Tender notice106773-2026 (opens in a new tab)
Deciding whether to bid?
Upload the tender pack and get a brief with every pass/fail requirement quoted from the documents, the scoring model and the questions you must answer. The first brief is free.